![]() ![]() ![]() 2IPC B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The geometry furnished for these devices, as well as inward and 'J' - formed lead contact device families, may provide a wider process window for reflow solder processes as well. 5-Tier Density Variations Supported 1IPC A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull wing devices. If you consider tolerance settings, units, line-widths, pad shapes, rotations, and many dozens of other settings (all configurable with the PCB Library Expert), you can create over 1,800 variations of ONE SINGLE library! We empower you to quickly build high-quality standard libraries to meet your specific needs.
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